COMPUTEX 2022: AMD Ryzen 7000 series launch with Socket AM5

At COMPUTEX 2022, AMD presents its new processor, which also uses the new platform. Namely the AMD Ryzen 7000 series processor which is equipped with the latest AM5 socket.

Shared directly by AMD CEO Dr. Lisa Su is different about her new processor. Assuming the use of the Zen 4 architecture on the new AMD Ryzen 7000 series processors, which will launch in the fall of 2022.
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In addition, Dr. Su highlights the strong growth and momentum for AMD in the mobile market, with 70 of the 200+ ultrathin commercial and gaming notebook designs expected to feature AMD Ryzen 6000-series processors launched or announced.

Another AMD executive announced the newest addition to the Ryzen Mobile lineup, Mendocino. supports AMD’s latest smart technology, SmartAccess Storage; and more details on the new AM5 socket, including support from leading motherboard manufacturers.

“At Computex 2022, we see AMD advances in ultra-thin gaming and commercial notebooks from leading PC vendors, backed by the cutting-edge performance and incredible battery life of our Ryzen 6000 series mobile processors,” said Dr. So.

“With our upcoming AMD Ryzen 7000 series desktop processors, we will bring even more leadership to the desktop market with our next-generation 5nm ‘Zen 4’ architecture and unrivaled high-performance computing experience for gamers and developers alike.” He continued.

AMD Ryzen 7000 series desktop processors
DR. Lisa Su announced the AMD Ryzen 7000 series processors at COMPUTEX 2022. (AMD)

The new AMD Ryzen 7000-series desktop processors continue the innovation and excellence of AMD Ryzen 5000-series desktop processors and are based on the highly efficient 5nm “Zen 4” architecture.

The new processors will double the amount of L2 cache per core, deliver higher clock speeds and are expected to deliver 15% better single-threaded performance than the previous generation for an unrivaled desktop PC experience.

Keynote demonstrated a pre-production Ryzen 7000 series desktop processor running at a clock speed of 5.5 GHz when playing AAA games. The same processor also proved to be over 30% faster than the Intel Core i9 12900K in Blender multi-threaded rendering workloads.

In addition to the new “Zen 4” computing, the Ryzen 7000 series features an all-new 6nm I/O die. The new I/O die includes an AMD RDNA 2 based graphics engine, a new low-power architecture inherited from AMD Ryzen mobile processors, support for the latest memory and connectivity technologies such as DDR5 and PCI Express 5.0, and up to 4 gigs of support.

AMD Socket AM5 Platform

The new AMD Socket AM5 platform offers advanced connectivity for the needs of our enthusiasts. This new socket features a 1718-pin LGA design with support for processors with a TDP of up to 170W, dual channel DDR5 memory, and a new SVI3 power infrastructure to match the performance of all cores with our processors at Ryzen to lead the 7000 series.

AMD Socket AM5 offers the industry’s most PCIe 5.0 lanes, up to 24 lanes, making it our fastest, largest, and most comprehensive desktop platform with support for more than just memory and next-generation graphics.

The AM5 series has three mainboard tiers:

X670 Extreme: Menawarkan konektivitas terbaik dan kemampuan overclocking ekstrem dengan dukungan PCIe 5.0 untuk dua slot pemrosesan grafis dan satu slot memori
X670: Mendukung penggemar overclocking dengan dukungan PCIe 5.0 di slot memori dengan dukungan GPU opsional
B650: Dirancang untuk pengguna kinerja dengan dukungan penyimpanan PCIe 5.0

Motherboard models with all three chipsets are expected from partners such as Asrock, Asus, Biostar, Gigabyte and MSI, and PCIe 5.0 storage solutions will be available from partners such as Crucial, Micron and Phison.

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